Thermal Effects on the Mechanical Performance of Adhesively Bonded T-Joints for Structural Applications to Support Sustainable Development Goals (SDGs)
Keywords:
Adhesive, Bond thickness, Perforated plate, Thermal condition, T-jointAbstract
This study investigates the thermal effects on the mechanical
performance of adhesively bonded T-joints, with a focus on
optimizing bond strength under elevated temperatures.
Using tensile testing, four adhesive thicknesses (0.5, 1.0, 1.5,
and 2.0 mm) were examined across five temperatures (room
temperature to 100°C). Results reveal that tensile strength
peaked at 35°C, aligning with the adhesive's glass transition
temperature (Tg), with 1.5 mm thickness yielding optimal
performance. Thicker bonds (2.0 mm) exhibited superior
strength at higher temperatures (55–100°C), while thinner
bonds performed best at lower temperatures. Differential
Scanning Calorimetry and SEM analyses confirmed thermal
degradation and morphological changes as key factors
influencing strength. These findings highlight the
relationship between adhesive thickness, thermal exposure,
and structural integrity, providing critical insights for the
aerospace and automotive industries. The study aligns with
SDG 9 (Industry, Innovation, and Infrastructure) by
supporting durable design practices and contributes to the
bibliometric discourse on epoxy-based adhesive
technologies under thermal stress.
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